TIF100-20-50S Thermally Conductive Gap Filler Pads Series for Graphics Card Thermal Module
Product descriptions
TlFTM100-20-50S Series thermally conductive interface materials are applied to fill he air gaps between the heating elements and the heat
dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive 2.0W/mK
> Naturally tacky needing no further adhesive coating
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Application
> Cooling components to the chassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED TV/ Lighting
> Graphics Card Thermal Module
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TIFTIM100-20-50S Series |
| Property | Value | Test method |
| Color | Pink | Visual |
| Construction | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 2.65g/cc | ASTM D297 |
| Thickness range | 0.020"~0.200"(0.5mm~5.0mm) | ASTM D374 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.7MHz | ASTM D150 |
| Volume Resistivity | 7.3X1013 Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Thermal conductivity | 2.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Specification
Standard Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
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TIF100-20-50S Thermally Conductive Gap Filler Pads Series for Graphics Card Thermal Module Images
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